The filling seams improvement and properties analyses of tungsten films
作者: Shaohui XuPan YaoJiandong ZhangRenrui Huang
作者单位: 1Huarun CSMC Technologies Corporation, No.8 Xinzhou Road,, Xinwu District, Wuxi City 214028, Jiangsu Province, China
刊名: Microelectronic Engineering, 2020, Vol.226
来源数据库: Elsevier Journal
DOI: 10.1016/j.mee.2020.111285
关键词: Tungsten fillingSeam improvementPropertiesH 2 flowNucleation time
英文摘要: Abstract(#br)The preferable conditions for tungsten filling and process parameters on tungsten film properties effect were investigated. The tungsten filling was improved obviously when H 2 flow is 1000 sccm, which is ascribed to slower deposition rate. Properly reducing H 2 flow could reduce tungsten deposition rate. For every H 2 flow reduction of 100 sccm, the film thickness was reduced by 58.5 Å. Decrease nucleation time to 7 s, it was conducive to tungsten filling as well. Researched showed that tungsten filling could be better optimized by reducing H 2 flow to 1000 sccm and nucleation time to 7 s simultaneously. The connect through (CT) holes contact resistance (R C ) value of new conditions (H2 flow:1000 sccm, nucleation time:7 s) was lower than that of baseline (H2 flow:1600 sccm,...
全文获取路径: Elsevier  (合作)
影响因子:1.224 (2012)

  • improvement 改良
  • tungsten 
  • filling 普染
  • properties 道具
  • films 薄膜