Simulation of 3D-Silicon sensors for the TIMESPOT project
作者: A. LoiA. LaiG.F. Dalla BettaR. MendicinoS. Vecchi
作者单位: 1Università degli studi di Cagliari, Cagliari, Italy
2Istituto Nazionale di Fisica Nucleare, sezione Cagliari, Cagliari, Italy
3Dipartimento di Ingegneria Industriale, Trento, Italy
4Trento Institute for Fundamental Phisycs and Application (TIFPA), Trento, Italy
5Istituto Nazionale di Fisica Nucleare, sezione Ferrara, Ferrara, Italy
刊名: Nuclear Inst. and Methods in Physics Research, A, 2018
来源数据库: Elsevier Journal
DOI: 10.1016/j.nima.2018.10.134
关键词: Tracking detectors3D silicon sensorsFast timing trackingSensor simulationTCAD
原始语种摘要: Abstract(#br)The experimental conditions in future High Luminosity LHC experiments require new detector systems with increased performances compared to the current state of the art. In this context, increasing spacial resolution and including time measurement with a resolution of less than 50 ps for particle tracking systems can avoid false track reconstruction due to event pile up. For this kind of future tracking detectors the 3D silicon sensor technology appears as a good option. In this context the TIMESPOT initiative was launched. Concerning the development of the sensor, different geometrical solutions have been explored and simulated to optimize the timing response of the single pixel sensor using Sentaurus TCAD. The configuration with the best electric field characteristics for...
全文获取路径: Elsevier  (合作)

  • tracking 跟踪
  • Tracking 追踪
  • sensor 感受器
  • consuming 耗的
  • silicon 
  • reconstruction 复原
  • pixel 像素
  • detector 探测器检波器
  • capacitive 电容的
  • overview 概观