Structure and stress of Cu films prepared by high power pulsed magnetron sputtering
作者: D.L. MaP.P. JingY.L. GongB.H. WuQ.Y. DengY.T. LiC.Z. ChenY.X. LengN. Huang
作者单位: 1Key Laboratory of Advanced Technologies of Materials, Ministry of Education, School of Materials Science and Engineering, Southwest Jiaotong University, Chengdu, 610031, China
刊名: Vacuum, 2019, Vol.160 , pp.226-232
来源数据库: Elsevier Journal
DOI: 10.1016/j.vacuum.2018.11.039
关键词: Cu filmsStress(111) textureAdhesionTi interlayerHigh power pulsed magnetron sputtering (HPPMS)
英文摘要: Abstract(#br)Owing to its high ionization degree, high power pulsed magnetron sputtering (HPPMS) has proven advantageous for Cu film growth. In this study, Cu films with different thicknesses deposited by HPPMS at different peak powers were prepared. Moreover, a titanium (Ti) interlayer was used to improve the Cu (111) out-of-plane preferred orientation and adhesion. The films prepared at high peak power exhibited high tensile stress, large grain size, and low electrical resistivity. Thicker Cu films exhibited lower stress and larger grain size, resulting in better electrical conductivity and adhesion. At the same time, a Ti interlayer with (002) preferred orientation could greatly improve the (111) out-of-plane preferred orientation and adhesion of the Cu film.
全文获取路径: Elsevier  (合作)
影响因子:1.53 (2012)

  • magnetron 磁控管
  • sputtering 溅射
  • pulsed 脉冲
  • prepared 有准备的
  • films 薄膜
  • stress 应力
  • power 功率