Corrigendum to: “Representative volume element analysis for wafer-level warpage using Finite Element methods” [Materials Science in Semiconductor Processing, 91 (2019) 392–398]
作者: Jong Won BaekWoo Seok YangMin Jae HurJin Chul YunSeong Jin Park
作者单位: 1Department of Mechanical Engineering Pohang University of Science and Technology (POSTECH), 77 Cheongam-ro, Nam-Gu, Pohang, Gyeongbuk 37673, Republic of Korea
2Process-Technology Computer Aided Design R&D Team, SK Hynix, 2091 Gyeongchung-daero, Bubal-eup, Icheon-si, Gyeonggi-do 17336, Republic of Korea
刊名: Materials Science in Semiconductor Processing, 2019, Vol.93 , pp.379-380
来源数据库: Elsevier Journal
DOI: 10.1016/j.mssp.2019.02.003
全文获取路径: Elsevier  (合作)
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来源刊物:
影响因子:1.338 (2012)

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关键词翻译
关键词翻译
  • 水准 体积
  • warpage 弯曲
  • wafer 薄片
  • element 元素
  • analysis 分析
  • volume 体积
  • level 体积