A new Cu(NbCN x ) film and some of its characteristics
作者: Chon-Hsin Lin
作者单位: 1Center for Generation Education, Chung Yuan Christian University, Chung Li, Taoyuan 320, Taiwan
刊名: Microelectronic Engineering, 2020, Vol.223
来源数据库: Elsevier Journal
DOI: 10.1016/j.mee.2020.111217
关键词: Cu alloy filmCu metallizationCo-sputteringResistivityConductivityHigh-temperature stabilityTDDB lifetimeAdhesion strengthInterconnect
英文摘要: Abstract(#br)In this study, a new type of 8 or 300 nm-thick Cu(NbCN x ) alloy films is created via barrierless Cu metallization by co-sputtering copper (Cu), niobium (Nb) and carbon (C) on silicon (Si) substrates within an Ar or Ar/N 2 vacuum charmer. Various composition sets were explored in search of an optimal set for the new film to achieve a lowest possible resistivity. The resistivity values of pure Cu, Cu(NbC) and the new films after isothermally and cyclically annealing at various temperatures were respectively measured and analyzed. The XRD patterns of the new films and Cu(NbC) films indicate that NbCN x and NbC phases discretely exist, that no compounds are formed by any interactions among Cu, Nb, and C, and that solidly-dissolved NbCN x and NbC phases can, respectively, boost...
全文获取路径: Elsevier  (合作)
影响因子:1.224 (2012)

  • metallization 成矿酌
  • lifetime 寿命
  • temperature 温度
  • stability 稳定性
  • sputtering 溅射
  • alloy 合金
  • strength 强度