Crack propagation in micro_chevron_test samples of direct bonded silicon_silicon wafers
作者: Klaus VogelDirk WuenschAlexey ShaporinJan MehnerDetlef BillepMaik Wiemer
作者单位: 1Chemnitz University of Technology, 09107 Chemnitz
2Fraunhofer research institution for Electronic Nano Systems ENAS, Technologie-Campus 3, 09126 Chemnitx
刊名: Fracture and Structural Integrity, 2011, Vol.5 (15), pp.21 - 28
来源数据库: Gruppo Italiano Frattura
DOI: 10.3221_IGF_ESIS.15.03
关键词: Compliance methodFE-analysisFracture toughnessMicro-chevron-testSilicon direct bonding
原始语种摘要: Wafer bonding describes all technologies for joining two or more substrates directly or using certain intermediate layers. Current investigations are focused on so_called low temperature bonding as a special direct bonding technology. It is carried out without intermediate layers and at temperatures below 400 oC. In addition to the wafer materials, the toughness of the bonded interface also depends on the bonding process itself. It can vary for different pre_treatments. Furthermore, an increase of the annealing temperature leads to a higher toughness of the bonded interface. The fracture toughness is a suitable value to describe the damage behaviour of the bonded interface. Based on a micro_chevron_specimen, the fracture toughness can be determined either numerically or by combining...
全文获取路径: Gruppo Italiano Frattura 

  • silicon 
  • bonded 保税
  • chevron 人字形
  • intensity 强度
  • micro 
  • coefficient 系数
  • toughness 韧性
  • wafer 薄片
  • interface 界面
  • numerically 数字上