Analysis of Printed Circuit Boards strains using finite element analysis and digital image correlation
作者: Liviu MarsavinaAlexandru FalkOctavian Pop
作者单位: 1POLITEHNICA University of Timisoara, Romania
2University of Politehnica Timisoara, Romania
3University of Limoges, France
刊名: Frattura ed Integrità Strutturale, 2020, Vol.14 (51), pp.541-551
来源数据库: Gruppo Italiano Frattura
DOI: 10.3221/IGF-ESIS.51.41
关键词: Digital image correlationFinite element analysisPCBStrain
原始语种摘要: This paper investigates the use of digital image correlation (DIC) and finite element analysis for strain measurement on Printed Board Circuits (PCBs). Circuit boards (PCBs) are designed to mechanically support and electrically connect an electronic component assembly. Due to screw assemblies, the surface level differences on which the PCB is placed, the process of assembling the electronic components induces a certain state of stress and deformation in the PCB. The main components affected are microprocessors due to the way they are glued to PCBs with BGA - Ball grid arrays (BGA). Digital Image Correlation (DIC) is a full-field contactless optical method for measuring displacements and strain in experimental testing, based on the correlation of images taken during test. The experimental...
全文获取路径: Gruppo Italiano Frattura 

  • image 
  • element 元素
  • digital 数字的
  • analysis 分析
  • finite 有限的
  • correlation 对比
  • PCB page control block
  • contactless 无接点的
  • measuring 测量
  • assembly 组装